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New tech, new ties :how mobile commu...
~
Ling, Richard Seyler.
New tech, new ties :how mobile communication is reshaping social cohesion /
Record Type:
Language materials, printed : Monograph/item
Title/Author:
New tech, new ties :/ Rich Ling.
Reminder of title:
how mobile communication is reshaping social cohesion /
Author:
Ling, Richard Seyler.
Published:
Cambridge, Mass. :MIT Press, : c2008.,
Description:
xv, 224 p. ;24 cm.;
Subject:
Cell phones - Social aspects. -
Online resource:
http://www.loc.gov/catdir/toc/ecip0719/2007022315.html
ISBN:
9780262122979 (hard) :
New tech, new ties :how mobile communication is reshaping social cohesion /
Ling, Richard Seyler.
New tech, new ties :
how mobile communication is reshaping social cohesion /Rich Ling. - Cambridge, Mass. :MIT Press,c2008. - xv, 224 p. ;24 cm.
Includes bibliographical references (p. [205]-221) and index.
ISBN: 9780262122979 (hard) :NT870
LCCN: 2007022315Subjects--Topical Terms:
295354
Cell phones
--Social aspects.
LC Class. No.: HE9713 / .M43 2008
Dewey Class. No.: 303.48/33
New tech, new ties :how mobile communication is reshaping social cohesion /
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Ling, Richard Seyler.
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New tech, new ties :
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how mobile communication is reshaping social cohesion /
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Rich Ling.
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MIT Press,
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xv, 224 p. ;
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24 cm.
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Includes bibliographical references (p. [205]-221) and index.
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Cell phones
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Social aspects.
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295354
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Social aspects.
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http://www.loc.gov/catdir/toc/ecip0719/2007022315.html
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前棟3F一般圖書區(圖書館) 3F General Monographic Collections (Front Building)
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00333021
前棟3F一般圖書區(圖書館) 3F General Monographic Collections (Front Building)
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一般圖書 (Book)
541.83 L755 2008
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