晶圓代工與先進封裝產業科技實務Wafer foundry and adv...
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  • 晶圓代工與先進封裝產業科技實務Wafer foundry and advanced package industry technology /
  • Record Type: Language materials, printed : Monograph/item
    Title/Author: 晶圓代工與先進封裝產業科技實務/ 曲建仲作
    Reminder of title: Wafer foundry and advanced package industry technology /
    remainder title: Wafer foundry and advanced package industry technology
    Author: 曲建仲
    Published: 臺北市 :知識力科技 ; : 2024[民113],
    [NT 15000922]: 初版
    Description: 279面 :彩圖, 表 :
    Notes: 資料型式: 文字
    Subject: 半導體工業 -
    Online resource: HyRead ebook電子書
    ISBN: 9786263288171
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